Senior Package Designer – AI Silicon Solutions

About the role

We are seeking a Senior Package Designer to lead the development of cutting‑edge AI silicon packages. You will work on high‑performance chipsets and intelligent machines that power enterprise AI workloads, from edge devices to large‑scale systems.

Key responsibilities

• Design and deliver flip‑chip BGA packages for next‑generation AI products.
• Conduct feasibility studies for new IP definitions and innovative package concepts.
• Own end‑to‑end substrate layout, ensuring successful tape‑out of multiple designs.
• Collaborate on co‑design across silicon, package, and board teams.
• Work closely with signal‑integrity, power‑integrity, PCB, mechanical and thermal engineers to meet product specifications.
• Interface with OSAT/packaging suppliers to align on design rules, DFM requirements, and BOM documentation.

Required profile

• 11+ years of experience in flip‑chip BGA package design.
• Proven track record with large form‑factor, high‑layer‑count designs and stack‑up definition.
• Strong understanding of package design rules, design‑for‑manufacturing and tape‑out processes.
• Experience with high‑speed SerDes (PCIe Gen6, 112‑224 GbE) and memory interfaces (DDR5, LPDDR, HBM).

Required skills

• Flip‑chip BGA package design
• Stack‑up and bump/ball map definition
• Package outline drawing creation
• Signal integrity and power integrity analysis
• High‑speed SerDes design (PCIe Gen6, 112‑224 GbE)
• Memory interface design (DDR5, LPDDR, HBM)
• Mentor Xpedition (preferred)