SMT Process Engineer (RBAI)

About the role

The role is based at Bosch Automotive Electronics India’s Naganathapura plant in Bengaluru. As an SMT Process Engineer you will be responsible for programming, optimizing and maintaining surface‑mount technology (SMT) equipment used in automotive electronic production.

Key responsibilities

• Develop, create, validate and release machine programs for Solder Paste Printing (SPP), SPI, Pick & Place, Reflow Oven and AOI.
• Optimize stencil design, printing parameters, component placement, thermal profiles and inspection settings to meet capability targets.
• Analyze cycle time, changeover time and setup losses and drive continuous‑improvement projects.
• Standardize program creation and validation across all SMT lines.
• Define, implement and maintain SOPs, work instructions, control plans and process standards for SMT operations.
• Establish control limits for paste height, volume, offset, placement accuracy, oven profile and AOI criteria.
• Conduct periodic audits and process confirmations to ensure compliance.
• Monitor solder paste deposition quality using SPI data and reduce defects such as insufficient solder, bridging, tombstones, skew and missing components.

Required profile

Required skills

• Solder Paste Printing (SPP)
• SPI (Solder Paste Inspection)
• Pick & Place machines
• Reflow Oven operation
• Automated Optical Inspection (AOI)