Mechanical Engineer – Electronics Packaging

About the role

The successful candidate will join Qualcomm’s Central Hardware Systems department to design high‑performance electronic assemblies for mobile, modem, compute, automotive and IoT products. You will work closely with teams in the US and India, translating concepts into detailed mechanical designs.

Key responsibilities

• Develop 3D models and detailed drawings using Creo solid‑modeling software.
• Define rigid and flexible circuit‑board outlines, mounting constraints and I/O layouts.
• Collaborate with PCB CAD designers through IDF/EMN file exchanges.
• Design shielding, gaskets, mechanical parts and system assemblies, including tolerance stack‑ups and GD&T specifications.
• Create BOMs, specify dimensional tolerances and manage tolerance analysis.
• Work with internal teams to select batteries, displays and audio components.
• Coordinate prototype fabrication in the internal machine shop and with external suppliers for injection‑molded tooling.
• Apply basic thermal analysis and recommend mitigation techniques.

Required profile

• 2–6 years of experience in mechanical engineering, thermal engineering or high‑density electronics packaging.
• Proven experience in mechanical design of electronic products/systems.
• Solid modeling expertise with Creo.

Required skills

• Creo solid‑modeling (assembly, part, drawing creation).
• GD&T and tolerance analysis.
• IDF/EMN file exchange.
• Design for CNC machining, injection molding and stamped metal parts.
• Basic thermal analysis and simulation.
• BOM creation and component selection.