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Mechanical Designer – Core Design (3-9 yrs)

HCLTech · Bengaluru

Mid 🇬🇧 English
UG NX GD&T Sheet Metal Design Tolerance Stack-up Semiconductor Fabrication Process Knowledge Structural & Thermal FEA ANSYS Abaqus SOM Documentation DFM/DFA PLM Tools

Job description

About the role

HCL Technologies is looking for a Mechanical Designer to join its Bangalore team. The role focuses on core mechanical design of semiconductor equipment, mechanical modules, sheet‑metal structures and precision assemblies, driving concepts from idea to validated product.

Key responsibilities

  • Create detailed 3D models and assemblies using UG NX, applying DFM/DFA principles and conducting trade‑off analyses.
  • Apply GD&T (ASME Y14.5) standards, perform 2D/3D tolerance stack‑ups and validate critical tolerances.
  • Design sheet‑metal enclosures, brackets and frames, ensuring manufacturability and proper bend allowances.
  • Leverage knowledge of vacuum design, plasma interaction, thermal loads and contamination control for semiconductor fabrication processes.
  • Select appropriate materials for vacuum and clean‑room environments and produce SOM documentation.
  • Conduct structural and thermal FEA using ANSYS or Abaqus, evaluate static/dynamic loads and validate heat dissipation.
  • Collaborate with electrical, systems, manufacturing, supply‑chain and reliability teams, leading design reviews.
  • Support prototype builds, functional testing, implement ECOs and release designs through PLM tools such as Teamcenter or Windchill.

Required profile

  • Bachelor’s or master’s degree in Mechanical Engineering or a related field.
  • 3–9 years of hands‑on mechanical design experience, preferably in semiconductor or high‑precision equipment.
  • Strong communication and presentation skills, with the ability to lead technical discussions.
  • Analytical problem‑solving capability and experience mentoring junior engineers.

Required skills

  • UG NX (expert level)
  • GD&T (ASME Y14.5)
  • Sheet‑metal design and drafting
  • Tolerance stack‑up (worst‑case & statistical)
  • Semiconductor fabrication process knowledge
  • Material selection for vacuum & clean‑room applications
  • Structural & thermal FEA (ANSYS/Abaqus)
  • SOM documentation
  • DFM/DFA application
  • PLM tools (Teamcenter/Windchill)

Questions fréquentes

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Published 1 month ago

Expires 1 week from now

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HCLTech

Bengaluru