Mechanical Engineer

About the role

The Mechanical Engineer will join Qualcomm's Central Hardware Systems department, collaborating with US and India teams to design high‑performance electronic assemblies for mobile, modem, compute, automotive, and IoT products. The role focuses on mechanical design, thermal considerations, and integration of electronic components.

Key responsibilities

• Develop 3D models and detailed drawings using Creo solid modeling software.
• Create concept layouts, define rigid and flexible circuit board outlines, and set mounting constraints.
• Coordinate electronic file exchanges (IDF/EMN) with circuit board CAD designers.
• Design shielding, gaskets, mechanical parts, and system assemblies.
• Specify dimensional tolerances, perform tolerance stack‑up analysis, and apply GD&T principles.
• Generate BOMs and collaborate with internal teams on battery, display, and audio component selection.
• Work with internal machine shop for prototypes and with external suppliers for tooling and volume production.
• Conduct basic thermal analysis and recommend mitigation techniques.

Required profile

• 2–6 years of experience in mechanical engineering, thermal engineering, or high‑density electronics packaging.
• Proven experience in mechanical design of electronic products/systems.
• Strong understanding of mechanical and thermal engineering fundamentals.
• Ability to work cross‑functionally with hardware, component, and thermal analysis teams.

Required skills

• Creo solid modeling (assembly, part, drawing creation).
• GD&T and tolerance analysis.
• Thermal analysis basics.
• CNC machining design.
• Injection molding and stamped metal part design.
• IDF/EMN file exchange.
• BOM creation and management.