Flip Chip Technician

About the role

The Flip Chip Technician is responsible for developing and qualifying technology and processes for flip‑chip product packaging. You will work across the full packaging flow, from back grinding to final packing, ensuring cost‑effective design‑for‑manufacturing solutions that meet customer requirements.

Key responsibilities

• Develop and qualify processes such as back grinding, laser groove, mechanical sawing, SMT, flip‑chip attach, mass reflow/TCB/fluxless, flux cleaning, plasma cleaning, underfill, mold underfill, ball attach, saw singulation, FVI, pick‑and‑place and final packing.
• Collaborate with vendors to gather data, perform technical analysis and support decision‑making.
• Select and qualify 4M components based on performance and past learnings.
• Install, buy‑off and qualify processes for NPI and high‑volume production.
• Drive continuous improvement to achieve high yield, quality and cost‑competitiveness.
• Identify process control requirements and support MES automation and recipe control.

Required profile

• Proven experience leading a team or group to achieve organizational goals.
• Strong knowledge of MS Office and documentation methods such as 8D, DOE, SPC, FMEA, OCAP and control plans.
• Passion for innovation, continuous learning and solving complex packaging challenges.

Required skills

• Back grinding, laser groove, mechanical sawing
• SMT, flip‑chip attach, mass reflow, TCB, fluxless processing
• Flux cleaning, plasma cleaning, underfill, mold underfill, ball attach
• Saw singulation, FVI, pick‑and‑place, packing
• MES, automation of material and process recipes
• 8D reporting, DOE, SPC, FMEA, OCAP, control plan development
• Proficiency with MS Office

What we offer

• Opportunities to work on cutting‑edge semiconductor packaging technologies.
• Collaborative environment with cross‑functional teams.
• Continuous professional development and innovation projects.