Flip Chip Technician

About the role

The Flip Chip Technician is responsible for developing and qualifying technology and processes for flip‑chip product packaging. You will work on a wide range of packaging steps, from back grinding and laser grooving to final assembly and packing, ensuring cost‑effective, design‑for‑manufacturing solutions that meet customer requirements.

Key responsibilities

• Develop and qualify processes such as back grinding, laser groove, mechanical sawing, SMT & flip‑chip attach, mass reflow/TCB/fluxless, flux cleaning, plasma cleaning, underfill, mold underfill, ball attach, saw singulation, FVI, pick‑and‑place and final packing.
• Collaborate with vendors to gather data, perform analyses, and support decision‑making for process selection.
• Select appropriate 4Ms (materials, methods, machines, manpower) based on performance data and past learnings.
• Install, buy‑off, and qualify processes for NPI and high‑volume production, aiming for high yield and quality.
• Define process control requirements, use BKM for data gathering, and assist with MES and automation of material, process, and recipe controls.

Required profile

• Strong understanding of semiconductor flip‑chip packaging technologies and DFM principles.
• Ability to integrate customer requirements into cost‑competitive solutions.
• Experience in technical discussions with vendors and cross‑functional project execution.
• Focus on continuous improvement, yield optimization, and quality excellence.

Required skills

• Back grinding
• Laser grooving
• Mechanical sawing
• SMT and flip‑chip attach
• Mass reflow / TCB / fluxless reflow
• Flux cleaning
• Plasma cleaning
• Underfill (including mold underfill)
• Ball attach
• Saw singulation
• FVI (Flip‑Chip Visual Inspection)
• Pick‑and‑place
• Packaging and final packing
• MES and process automation